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Research literature / Conference paper

Fluorine-free i-line thick film photoresist for advanced semiconductor packaging

Lei Lu; Hung-Yang Chen; Ionela-Daniela Carja; Megumi Takahashi; Stefan Michlik; Walter Weihong Liu; Chunwei Chen

Published
Publisher
SPIE
Journal / collection
Advances in Patterning Materials and Processes XLII
Research area
Semiconductors
Source type
Conference paper
DOI
10.1117/12.3050807

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Lei Lu; Hung-Yang Chen; Ionela-Daniela Carja; Megumi Takahashi; Stefan Michlik; Walter Weihong Liu; Chunwei Chen. Fluorine-free i-line thick film photoresist for advanced semiconductor packaging. Advances in Patterning Materials and Processes XLII. 2025-04-22. https://doi.org/10.1117/12.3050807

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