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Research literature / Conference paper

Oxidation-Inhibited Cu Direct Bonding via Glucose Vapor for Green Semiconductor Packaging

Nahye Kim; Jeehoo Na; Minhyuck Lee; Eunhye Lee; Tae-Ik Lee

Published
Publisher
IEEE
Journal / collection
2025 20th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Research area
Semiconductors
Source type
Conference paper
DOI
10.1109/impact67645.2025.11281710

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Nahye Kim; Jeehoo Na; Minhyuck Lee; Eunhye Lee; Tae-Ik Lee. Oxidation-Inhibited Cu Direct Bonding via Glucose Vapor for Green Semiconductor Packaging. 2025 20th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). 2025-10-21. https://doi.org/10.1109/impact67645.2025.11281710

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