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Research literature / Conference paper

REDM: Regression-Guided Diffusion Modeling for Universal Soft Sensor Enhancement in Semiconductor Process Control

Weiping Xie; Yumeng Shi; Pang Guo; Yining Chen

Published
Publisher
IEEE
Journal / collection
2026 31st Asia and South Pacific Design Automation Conference (ASP-DAC)
Research area
Semiconductors
Source type
Conference paper
DOI
10.1109/asp-dac66049.2026.11420290

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Weiping Xie; Yumeng Shi; Pang Guo; Yining Chen. REDM: Regression-Guided Diffusion Modeling for Universal Soft Sensor Enhancement in Semiconductor Process Control. 2026 31st Asia and South Pacific Design Automation Conference (ASP-DAC). 2026-01-19. https://doi.org/10.1109/asp-dac66049.2026.11420290

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