Multi-field coupled vibration analysis of sandwich piezoelectric semiconductor cylindrical shells under thermal loading
Yaxi Yan; Changsong Zhu; Xueqian Fang
- Published
- Publisher
- Springer Science and Business Media LLC
- Journal / collection
- Archive of Applied Mechanics
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1007/s00419-026-03093-6
The original publisher provides the full text and its access options.
Cite this source
Yaxi Yan; Changsong Zhu; Xueqian Fang. Multi-field coupled vibration analysis of sandwich piezoelectric semiconductor cylindrical shells under thermal loading. Archive of Applied Mechanics. 2026-05. https://doi.org/10.1007/s00419-026-03093-6