Advanced back grinding of semiconductor wafers using an angle-feedback TTV compensation controller
Byung-Hyun Hwang; Kyoung-Su Park
- Published
- Publisher
- Elsevier BV
- Journal / collection
- Precision Engineering
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1016/j.precisioneng.2025.08.001
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Cite this source
Byung-Hyun Hwang; Kyoung-Su Park. Advanced back grinding of semiconductor wafers using an angle-feedback TTV compensation controller. Precision Engineering. 2025-10. https://doi.org/10.1016/j.precisioneng.2025.08.001