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Research literature / Conference paper

Comprehensive Interface Adhesion Characterization for Advanced Semiconductor Packaging

Dong Jun Kim; Sun Woo Lee; Won Choi; Ho Jun Chang; Inhwa Lee; Seungju Park; Jihyun Lee; Joong Jung Kim; Sumin Kang; Taek-Soo Kim

Published
Publisher
IEEE
Journal / collection
2025 20th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Research area
Semiconductors
Source type
Conference paper
DOI
10.1109/impact67645.2025.11281687

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Dong Jun Kim; Sun Woo Lee; Won Choi; Ho Jun Chang; Inhwa Lee; Seungju Park; Jihyun Lee; Joong Jung Kim; Sumin Kang; Taek-Soo Kim. Comprehensive Interface Adhesion Characterization for Advanced Semiconductor Packaging. 2025 20th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). 2025-10-21. https://doi.org/10.1109/impact67645.2025.11281687

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