Hybrid additive manufacturing of flexible copper radiofrequency electronics
Abdullah Islam; Zhongxuan Wang; Ted Dabrowski; Kalsi Kwan; Saurabh Khuje; Jian Yu; John D. Williams; Shenqiang Ren
- Published
- Publisher
- Elsevier BV
- Journal / collection
- Materials Today
- Research area
- Industrial systems
- Source type
- Journal article
- DOI
- 10.1016/j.mattod.2024.12.016
The original publisher provides the full text and its access options.
Cite this source
Abdullah Islam; Zhongxuan Wang; Ted Dabrowski; Kalsi Kwan; Saurabh Khuje; Jian Yu; John D. Williams; Shenqiang Ren. Hybrid additive manufacturing of flexible copper radiofrequency electronics. Materials Today. 2025-03. https://doi.org/10.1016/j.mattod.2024.12.016