Semiconductor-Thermal Co-Simulation Based on FEM
Hang Liu; Zhi Peng Du; Zheng Jun Shen; Huan Huan Zhang
- Published
- Publisher
- IEEE
- Journal / collection
- 2025 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1109/nemo62710.2025.11215242
The original publisher provides the full text and its access options.
Cite this source
Hang Liu; Zhi Peng Du; Zheng Jun Shen; Huan Huan Zhang. Semiconductor-Thermal Co-Simulation Based on FEM. 2025 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO). 2025-07-29. https://doi.org/10.1109/nemo62710.2025.11215242