Electrodeposition of Cu-Mn Alloys for Semiconductor Interconnect Applications
Madaline Rae Oakes; Christian John Kellamis; Nicholas Scott Sinclair; Rohan Akolkar
- Published
- Publisher
- The Electrochemical Society
- Journal / collection
- ECS Meeting Abstracts
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1149/ma2026-01251319mtgabs
The original publisher provides the full text and its access options.
Cite this source
Madaline Rae Oakes; Christian John Kellamis; Nicholas Scott Sinclair; Rohan Akolkar. Electrodeposition of Cu-Mn Alloys for Semiconductor Interconnect Applications. ECS Meeting Abstracts. 2026-07-07. https://doi.org/10.1149/ma2026-01251319mtgabs