Super Resolution of Acoustic Microscopy Image Using Real-ESRGAN for Semiconductor Packages
Wen-Hao Chia; Zi-Ying Oh
- Published
- Publisher
- IEEE
- Journal / collection
- 2025 IEEE 32nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1109/ipfa65338.2025.11251498
The original publisher provides the full text and its access options.
Cite this source
Wen-Hao Chia; Zi-Ying Oh. Super Resolution of Acoustic Microscopy Image Using Real-ESRGAN for Semiconductor Packages. 2025 IEEE 32nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA). 2025-08-05. https://doi.org/10.1109/ipfa65338.2025.11251498