Abrasive Materials for Semiconductor Chemical Mechanical Polishing: Composition, Performance, and Emerging Trends
Xianlian Lin; Jiali Wang; Shuhao Cai; Yongjiang Wang; Zhenguo Liu
- Published
- Publisher
- American Chemical Society (ACS)
- Journal / collection
- ACS Applied Materials & Interfaces
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1021/acsami.6c04556
The original publisher provides the full text and its access options.
Cite this source
Xianlian Lin; Jiali Wang; Shuhao Cai; Yongjiang Wang; Zhenguo Liu. Abrasive Materials for Semiconductor Chemical Mechanical Polishing: Composition, Performance, and Emerging Trends. ACS Applied Materials & Interfaces. 2026-05-19. https://doi.org/10.1021/acsami.6c04556