Power Packaging for AI/ Data Center from Grid to Core

Thorsten Meyer

Published: 11 August 2026
Publisher: IMAPS - International Microelectronics Assembly and Packaging Society
Journal / collection: IMAPSource Proceedings
Research area: AI & compute
Source type: Journal article
DOI: 10.4071/001c.166905

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Thorsten Meyer. Power Packaging for AI/ Data Center from Grid to Core. IMAPSource Proceedings. 2026-08-11. https://doi.org/10.4071/001c.166905