CHIPS Incentives Program—Semiconductor materials and manufacturing equipment (DOC)

Published: 18 August 2026
Publisher: Wiley
Journal / collection: Federal Grants & Contracts
Research area: Semiconductors
Source type: Journal article
DOI: 10.1002/fgc.34907

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Wiley. CHIPS Incentives Program—Semiconductor materials and manufacturing equipment (DOC). Federal Grants & Contracts. 2026-08-18. https://doi.org/10.1002/fgc.34907

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