Process challenges and future pathways of 2D semiconductor chips
Jianfeng JIANG; Peng WU; Lian-Mao PENG
- Published
- Publisher
- China Science Publishing & Media Ltd.
- Journal / collection
- Chinese Journal of Semiconductors
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.3724/cjos.2025.031
The original publisher provides the full text and its access options.
Cite this source
Jianfeng JIANG; Peng WU; Lian-Mao PENG. Process challenges and future pathways of 2D semiconductor chips. Chinese Journal of Semiconductors. 2026-07-01. https://doi.org/10.3724/cjos.2025.031