Optimizing warpage in semiconductor packaging using GA-NN and conditional GAN with explainable AI
Hung-Kai Wang; Yan-Cheng Lin; Tang-Yuan Chen; Chen-Chao Wang; Chin-Pin Hung
- Published
- Publisher
- Elsevier BV
- Journal / collection
- Computers & Industrial Engineering
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1016/j.cie.2025.111246
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Cite this source
Hung-Kai Wang; Yan-Cheng Lin; Tang-Yuan Chen; Chen-Chao Wang; Chin-Pin Hung. Optimizing warpage in semiconductor packaging using GA-NN and conditional GAN with explainable AI. Computers & Industrial Engineering. 2025-08. https://doi.org/10.1016/j.cie.2025.111246