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Research literature / Preprint / posted paper

Packaging-Aware EMC for 2.5D/3D Semiconductor Devices with Key-Point Radiated Checks

Lv Xin; Wang Yeliang

Published
Publisher
MDPI AG
Research area
Semiconductors
Source type
Preprint / posted paper
DOI
10.20944/preprints202510.0867.v1

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Lv Xin; Wang Yeliang. Packaging-Aware EMC for 2.5D/3D Semiconductor Devices with Key-Point Radiated Checks. MDPI AG. 2025-10-11. https://doi.org/10.20944/preprints202510.0867.v1

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