Clustering-Enhanced Deep Surrogate Model for Global Stress and Weak-Point Detection in Semiconductor Packaging
Boo Soo Ma; Boyeon Kim; Myoung Song; Tae Yeob Kang; Taek-Soo Kim
- Published
- Publisher
- IEEE
- Journal / collection
- 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.23919/icep-hbs69241.2026.11550621
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Cite this source
Boo Soo Ma; Boyeon Kim; Myoung Song; Tae Yeob Kang; Taek-Soo Kim. Clustering-Enhanced Deep Surrogate Model for Global Stress and Weak-Point Detection in Semiconductor Packaging. 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS). 2026-04-14. https://doi.org/10.23919/icep-hbs69241.2026.11550621