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Research literature / Journal article

Quantitative Single-Particle Analysis: Plasmon Damping Modulation via Interfacial Engineering in Metal–Semiconductor Matchstick Heterostructures

Rafifah Hana Raihana Syam; Yola Yolanda Alizar; Ji Won Ha

Published
Publisher
American Chemical Society (ACS)
Journal / collection
Analytical Chemistry
Research area
Semiconductors
Source type
Journal article
DOI
10.1021/acs.analchem.6c00492

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Rafifah Hana Raihana Syam; Yola Yolanda Alizar; Ji Won Ha. Quantitative Single-Particle Analysis: Plasmon Damping Modulation via Interfacial Engineering in Metal–Semiconductor Matchstick Heterostructures. Analytical Chemistry. 2026-05-13. https://doi.org/10.1021/acs.analchem.6c00492

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