Design for Manufacturing in Wafer Level Fan-Out Packaging
Yifan Wang; Alfred Yeo
- Published
- Publisher
- IEEE
- Journal / collection
- 2025 26th International Conference on Electronic Packaging Technology (ICEPT)
- Research area
- Industrial systems
- Source type
- Conference paper
- DOI
- 10.1109/icept67137.2025.11157234
The original publisher provides the full text and its access options.
Cite this source
Yifan Wang; Alfred Yeo. Design for Manufacturing in Wafer Level Fan-Out Packaging. 2025 26th International Conference on Electronic Packaging Technology (ICEPT). 2025-08-05. https://doi.org/10.1109/icept67137.2025.11157234