Semiconductor Wafer Flatness and Thickness Measurement Using Frequency Scanning Interferometry Technology
Weisheng Cheng; Zexiao Li; Xuanzong Wu; Shuangxiong Yin; Bo Zhang; Xiaodong Zhang
- Published
- Publisher
- MDPI AG
- Journal / collection
- Photonics
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.3390/photonics12070663
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Cite this source
Weisheng Cheng; Zexiao Li; Xuanzong Wu; Shuangxiong Yin; Bo Zhang; Xiaodong Zhang. Semiconductor Wafer Flatness and Thickness Measurement Using Frequency Scanning Interferometry Technology. Photonics. 2025-06-30. https://doi.org/10.3390/photonics12070663