Advanced WBG power semiconductor packaging: nanomaterials and nanotechnologies for high-performance die attach paste
Young-Min Ju; Tae-Wan Kim; Seung-Hyun Lee; Ho-Jin Lee; Jinho Ahn; Hak-Sung Kim
- Published
- Publisher
- Springer Science and Business Media LLC
- Journal / collection
- Nano Convergence
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1186/s40580-025-00503-3
The original publisher provides the full text and its access options.
Cite this source
Young-Min Ju; Tae-Wan Kim; Seung-Hyun Lee; Ho-Jin Lee; Jinho Ahn; Hak-Sung Kim. Advanced WBG power semiconductor packaging: nanomaterials and nanotechnologies for high-performance die attach paste. Nano Convergence. 2025-07-23. https://doi.org/10.1186/s40580-025-00503-3