Topology Optimization of Backside Films to Mitigate Semiconductor Wafer Warpage
Won Hong Choi; Gil-Eon Jeong
- Published
- Publisher
- ASME International
- Journal / collection
- Journal of Electronic Packaging
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1115/1.4071548
The original publisher provides the full text and its access options.
Cite this source
Won Hong Choi; Gil-Eon Jeong. Topology Optimization of Backside Films to Mitigate Semiconductor Wafer Warpage. Journal of Electronic Packaging. 2026-06-01. https://doi.org/10.1115/1.4071548