Material Needs and Measurement Challenges for Advanced Semiconductor Packaging: Understanding the Soft Side of Science

Source organization

NIST

Published

2025

Research area

Semiconductors

Document type

Research paper

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Citation

NIST. Material Needs and Measurement Challenges for Advanced Semiconductor Packaging: Understanding the Soft Side of Science. 2025. https://www.nist.gov/publications/material-needs-and-measurement-challenges-advanced-semiconductor-packaging

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