Stress-induced warpage estimation of advanced semiconductor copper interconnect processes
Chang-Chun Lee; Yen-Hung Lin; Dei-Pei Yang
- Published
- Publisher
- Elsevier BV
- Journal / collection
- International Journal of Mechanical Sciences
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1016/j.ijmecsci.2024.109744
The original publisher provides the full text and its access options.
Cite this source
Chang-Chun Lee; Yen-Hung Lin; Dei-Pei Yang. Stress-induced warpage estimation of advanced semiconductor copper interconnect processes. International Journal of Mechanical Sciences. 2024-12. https://doi.org/10.1016/j.ijmecsci.2024.109744