Evaluation Platforms for Next-Generation Semiconductor Packaging Technologies
Hirokazu Noma
- Published
- Publisher
- The Japan Society of Applied Physics
- Journal / collection
- Extended Abstracts of the 2024 International Conference on Solid State Devices and Materials
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.7567/ssdm.2024.c-2-01
The original publisher provides the full text and its access options.
Cite this source
Hirokazu Noma. Evaluation Platforms for Next-Generation Semiconductor Packaging Technologies. Extended Abstracts of the 2024 International Conference on Solid State Devices and Materials. 2024-09-02. https://doi.org/10.7567/ssdm.2024.c-2-01