Cold Sprayed Copper-Diamond Composites for Thermal Management of Semiconductor Packages
Wenhao (Eric) Li; Feras Eid; Yoshihiro Tomita; Johanna Swan
- Published
- Publisher
- IMAPS - International Microelectronics Assembly and Packaging Society
- Journal / collection
- IMAPSource Proceedings
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.4071/001c.128390
The original publisher provides the full text and its access options.
Cite this source
Wenhao (Eric) Li; Feras Eid; Yoshihiro Tomita; Johanna Swan. Cold Sprayed Copper-Diamond Composites for Thermal Management of Semiconductor Packages. IMAPSource Proceedings. 2025-01-14. https://doi.org/10.4071/001c.128390