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Research literature / Conference paper

Modeling of Backside Power Delivery and Thermal Management in Semiconductor Die Packages

Zekun Wu; Xin Zhang; Shurong Tian; Ashwin R Kidambi; Justin A. Weibel; Liang Pan

Published
Publisher
IEEE
Journal / collection
2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Research area
Semiconductors
Source type
Conference paper
DOI
10.1109/itherm55375.2024.10709612

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Zekun Wu; Xin Zhang; Shurong Tian; Ashwin R Kidambi; Justin A. Weibel; Liang Pan. Modeling of Backside Power Delivery and Thermal Management in Semiconductor Die Packages. 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). 2024-05-28. https://doi.org/10.1109/itherm55375.2024.10709612

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