A Study in Improvement of Anisotropic Copper Wet Etching for Semiconductor Packaging
Suyeon Park; Inyeol Park; Jihwan Kong; Jonghyun Seo
- Published
- Publisher
- IEEE
- Journal / collection
- 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1109/eptc62800.2024.10909773
The original publisher provides the full text and its access options.
Cite this source
Suyeon Park; Inyeol Park; Jihwan Kong; Jonghyun Seo. A Study in Improvement of Anisotropic Copper Wet Etching for Semiconductor Packaging. 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC). 2024-12-03. https://doi.org/10.1109/eptc62800.2024.10909773