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Research literature / Conference paper

A Streamlined Electro-Thermal-Mechanical Simulation Method for Power Semiconductor Packaging Design

Zixiao Huang; Daniel Wu; Robin Sun

Published
Publisher
IEEE
Journal / collection
2025 Conference of Science and Technology of Integrated Circuits (CSTIC)
Research area
Semiconductors
Source type
Conference paper
DOI
10.1109/cstic64481.2025.11017895

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Zixiao Huang; Daniel Wu; Robin Sun. A Streamlined Electro-Thermal-Mechanical Simulation Method for Power Semiconductor Packaging Design. 2025 Conference of Science and Technology of Integrated Circuits (CSTIC). 2025-03-24. https://doi.org/10.1109/cstic64481.2025.11017895

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