Wafer-to-Wafer Bonding for Advanced Manufacturing Nodes
Thomas Plach; Anton Alexeev; Christoph Flötgen; Lukas Koller; Viorel Dragoi; Thomas Uhrmann
- Published
- Publisher
- IEEE
- Journal / collection
- 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
- Research area
- Industrial systems
- Source type
- Conference paper
- DOI
- 10.1109/ltb-3d64053.2024.10772720
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Cite this source
Thomas Plach; Anton Alexeev; Christoph Flötgen; Lukas Koller; Viorel Dragoi; Thomas Uhrmann. Wafer-to-Wafer Bonding for Advanced Manufacturing Nodes. 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). 2024-10-30. https://doi.org/10.1109/ltb-3d64053.2024.10772720