(Invited) Cu-Cu Bonding in Semiconductor Packaging: Utilizing Texture Control for Enhanced Performance
Haneul Han; Sanghwa Yoon; Bongyoung Yoo
- Published
- Publisher
- The Electrochemical Society
- Journal / collection
- ECS Meeting Abstracts
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1149/ma2024-02231985mtgabs
The original publisher provides the full text and its access options.
Cite this source
Haneul Han; Sanghwa Yoon; Bongyoung Yoo. (Invited) Cu-Cu Bonding in Semiconductor Packaging: Utilizing Texture Control for Enhanced Performance. ECS Meeting Abstracts. 2024-11-22. https://doi.org/10.1149/ma2024-02231985mtgabs