Enhancing Semiconductor Package Reliability through Mechanical Property Optimization of Pressureless Sintering Die Attach Adhesives
Xuan Hong; Bo Xia; Vincent Pang; Lina Bian; Xinpei Cao; Noah Ekstrom; Juliet Sanchez; Edward Ho; Selene Hernandez; Qizhuo Zhuo; Rejoy Surendran
- Published
- Publisher
- IMAPS - International Microelectronics Assembly and Packaging Society
- Journal / collection
- IMAPSource Proceedings
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.4071/001c.94312
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Cite this source
Xuan Hong; Bo Xia; Vincent Pang; Lina Bian; Xinpei Cao; Noah Ekstrom; Juliet Sanchez; Edward Ho; Selene Hernandez; Qizhuo Zhuo; Rejoy Surendran. Enhancing Semiconductor Package Reliability through Mechanical Property Optimization of Pressureless Sintering Die Attach Adhesives. IMAPSource Proceedings. 2024-02-23. https://doi.org/10.4071/001c.94312