Inspection Methodology for Improving Wafer Quality in Semiconductor Production
So-Young Kwon; Young-Hyung Kim; Yong-Hwan Lee; Jong-Ik Park; Chang-Yong Lee
- Published
- Publisher
- IEEE
- Journal / collection
- 2024 Joint International Conference on Digital Arts, Media and Technology with ECTI Northern Section Conference on Electrical, Electronics, Computer and Telecommunications Engineering (ECTI DAMT & NCON)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1109/ectidamtncon60518.2024.10480090
The original publisher provides the full text and its access options.
Cite this source
So-Young Kwon; Young-Hyung Kim; Yong-Hwan Lee; Jong-Ik Park; Chang-Yong Lee. Inspection Methodology for Improving Wafer Quality in Semiconductor Production. 2024 Joint International Conference on Digital Arts, Media and Technology with ECTI Northern Section Conference on Electrical, Electronics, Computer and Telecommunications Engineering (ECTI DAMT & NCON). 2024-01-31. https://doi.org/10.1109/ectidamtncon60518.2024.10480090