Post-Bond TSV Defect Detection Circuit Based on a Cross-Coupled Transistor Pair With Positive Feedback Mechanism
Changle Zhi; Lihang Wang; Gang Dong; Sirui Yin; Jiaji Ma; Xiaoxian Liu; Zhangming Zhu
- Published
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Journal / collection
- IEEE Transactions on Instrumentation and Measurement
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1109/tim.2025.3626983
The original publisher provides the full text and its access options.
Cite this source
Changle Zhi; Lihang Wang; Gang Dong; Sirui Yin; Jiaji Ma; Xiaoxian Liu; Zhangming Zhu. Post-Bond TSV Defect Detection Circuit Based on a Cross-Coupled Transistor Pair With Positive Feedback Mechanism. IEEE Transactions on Instrumentation and Measurement. 2025. https://doi.org/10.1109/tim.2025.3626983