Investigating the impacts of heat sink design parameters on heat dissipation performance of semiconductor packages
Rilwan Kayode Apalowo; Aizat Abas; Muhammad Razin Salim; Mohamed Fikri Mohd Sharif; Chia Siang Kok
- Published
- Publisher
- Elsevier BV
- Journal / collection
- International Journal of Thermal Sciences
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1016/j.ijthermalsci.2024.109490
The original publisher provides the full text and its access options.
Cite this source
Rilwan Kayode Apalowo; Aizat Abas; Muhammad Razin Salim; Mohamed Fikri Mohd Sharif; Chia Siang Kok. Investigating the impacts of heat sink design parameters on heat dissipation performance of semiconductor packages. International Journal of Thermal Sciences. 2025-02. https://doi.org/10.1016/j.ijthermalsci.2024.109490