Thermal Boundary Resistance of Bonded Semiconductor Interfaces
Zhe Cheng
- Published
- Publisher
- IEEE
- Journal / collection
- 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1109/ltb-3d64053.2024.10774109
The original publisher provides the full text and its access options.
Cite this source
Zhe Cheng. Thermal Boundary Resistance of Bonded Semiconductor Interfaces. 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). 2024-10-30. https://doi.org/10.1109/ltb-3d64053.2024.10774109