Exploring Influential Factors Affecting Baseplate Distortion and Residual Stress in Insulated-Gate Bipolar Transistor (IGBT) Modules During Reflow Soldering
Shang Gao; Chunzhuang Teng; Haoxiang Wang; Honggang Li; Renke Kang
- Published
- Publisher
- Springer Science and Business Media LLC
- Journal / collection
- Journal of Electronic Materials
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1007/s11664-024-11341-0
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Cite this source
Shang Gao; Chunzhuang Teng; Haoxiang Wang; Honggang Li; Renke Kang. Exploring Influential Factors Affecting Baseplate Distortion and Residual Stress in Insulated-Gate Bipolar Transistor (IGBT) Modules During Reflow Soldering. Journal of Electronic Materials. 2024-08-01. https://doi.org/10.1007/s11664-024-11341-0