Electrical-Thermal Multiphysical Analysis of On-Chip Power Grid
Shang Li; Linghai Jiang; Xiaoxin Zhou; Ting Wan
- Published
- Publisher
- IEEE
- Journal / collection
- 2024 IEEE International Conference on Computational Electromagnetics (ICCEM)
- Research area
- Energy & infrastructure
- Source type
- Conference paper
- DOI
- 10.1109/iccem60619.2024.10558882
The original publisher provides the full text and its access options.
Cite this source
Shang Li; Linghai Jiang; Xiaoxin Zhou; Ting Wan. Electrical-Thermal Multiphysical Analysis of On-Chip Power Grid. 2024 IEEE International Conference on Computational Electromagnetics (ICCEM). 2024-04-15. https://doi.org/10.1109/iccem60619.2024.10558882