Initiation and arrest of cracks from corners in multi-chip semiconductor devices
Guodong Nian; Yu-Sheng Lin; Jia-Ming Yang; Sammy Hassan; Jyun-Lin Wu; Sherwin Tang; Jun He; Joost J. Vlassak; Zhigang Suo
- Published
- Publisher
- Elsevier BV
- Journal / collection
- Journal of the Mechanics and Physics of Solids
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1016/j.jmps.2024.105755
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Cite this source
Guodong Nian; Yu-Sheng Lin; Jia-Ming Yang; Sammy Hassan; Jyun-Lin Wu; Sherwin Tang; Jun He; Joost J. Vlassak; Zhigang Suo. Initiation and arrest of cracks from corners in multi-chip semiconductor devices. Journal of the Mechanics and Physics of Solids. 2024-10. https://doi.org/10.1016/j.jmps.2024.105755