Effective Lead Lock Tape Solution for Mitigating Leadframe's Lead Bend in Semiconductor Packaging
Mahenthren Palaniappan; Dhanaraj Perumal; Nur Amirah Zainal Abdin; Wai Leong Khiew; Lim Zikang; Nur Aqilah Husin
- Published
- Publisher
- IEEE
- Journal / collection
- 2024 IEEE 40th International Electronics Manufacturing Technology (IEMT)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1109/iemt61324.2024.10875273
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Cite this source
Mahenthren Palaniappan; Dhanaraj Perumal; Nur Amirah Zainal Abdin; Wai Leong Khiew; Lim Zikang; Nur Aqilah Husin. Effective Lead Lock Tape Solution for Mitigating Leadframe's Lead Bend in Semiconductor Packaging. 2024 IEEE 40th International Electronics Manufacturing Technology (IEMT). 2024-10-16. https://doi.org/10.1109/iemt61324.2024.10875273