Stress Analysis on Hybrid Nanoparticle GNP/Ag for Flexible Semiconductor Packaging Devices
Norida Mohammad Noor; Mohd Azli Salim; Nor Azmmi Masripan; Chonlatee Photong; Kit Wayne Chew; Alan Watson
- Published
- Publisher
- Akademia Baru Publishing
- Journal / collection
- Journal of Advanced Research in Micro and Nano Engineering
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.37934/armne.30.1.2232
The original publisher provides the full text and its access options.
Cite this source
Norida Mohammad Noor; Mohd Azli Salim; Nor Azmmi Masripan; Chonlatee Photong; Kit Wayne Chew; Alan Watson. Stress Analysis on Hybrid Nanoparticle GNP/Ag for Flexible Semiconductor Packaging Devices. Journal of Advanced Research in Micro and Nano Engineering. 2025-02-28. https://doi.org/10.37934/armne.30.1.2232