Automated visual inspection of particle defect in semiconductor packaging
Joonsub Park; Jeonghoon Lee
- Published
- Publisher
- Springer Science and Business Media LLC
- Journal / collection
- Journal of Mechanical Science and Technology
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1007/s12206-024-0740-6
The original publisher provides the full text and its access options.
Cite this source
Joonsub Park; Jeonghoon Lee. Automated visual inspection of particle defect in semiconductor packaging. Journal of Mechanical Science and Technology. 2024-08. https://doi.org/10.1007/s12206-024-0740-6