Impact of trimodal copper powder mixing on copper-sintered joints for power semiconductor packaging
Eun-Chae Noh; Byung-Suk Lee; Yong-Ho Ko; Jeong-Won Yoon
- Published
- Publisher
- Elsevier BV
- Journal / collection
- Materials Today Communications
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1016/j.mtcomm.2025.111737
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Cite this source
Eun-Chae Noh; Byung-Suk Lee; Yong-Ho Ko; Jeong-Won Yoon. Impact of trimodal copper powder mixing on copper-sintered joints for power semiconductor packaging. Materials Today Communications. 2025-02. https://doi.org/10.1016/j.mtcomm.2025.111737