Mechanical Property Evaluation of Sublimation Agents on Nanostructure Stability in Semiconductor
Yosuke Hanawa; Jianliang Zhang; Yuta Sasaki; Koichi Sawada; Junichi Yoshida; Minghan Xu; Mohammaderfan Mohit; Agus P. Sasmito; Atsushi Sakuma
- Published
- Publisher
- American Society of Mechanical Engineers
- Journal / collection
- Volume 9: Heat Transfer and Thermal Engineering
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1115/imece2024-143402
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Cite this source
Yosuke Hanawa; Jianliang Zhang; Yuta Sasaki; Koichi Sawada; Junichi Yoshida; Minghan Xu; Mohammaderfan Mohit; Agus P. Sasmito; Atsushi Sakuma. Mechanical Property Evaluation of Sublimation Agents on Nanostructure Stability in Semiconductor. Volume 9: Heat Transfer and Thermal Engineering. 2024-11-17. https://doi.org/10.1115/imece2024-143402