Flattening the Silicon Nitride Surface of Semiconductor Chips Through Etching Processes
Donghan Wang; Zhongwei Jiang; Jing Wang; Yingming Ma
- Published
- Publisher
- IEEE
- Journal / collection
- 2024 Conference of Science and Technology for Integrated Circuits (CSTIC)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1109/cstic61820.2024.10532073
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Cite this source
Donghan Wang; Zhongwei Jiang; Jing Wang; Yingming Ma. Flattening the Silicon Nitride Surface of Semiconductor Chips Through Etching Processes. 2024 Conference of Science and Technology for Integrated Circuits (CSTIC). 2024-03-17. https://doi.org/10.1109/cstic61820.2024.10532073