Custom Design Experiments for Semiconductor Package Optimization
Yung-Seop Lee; Hyewon Ko; Min Soo Park; Yonghan Ju
- Published
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Journal / collection
- IEEE Transactions on Components, Packaging and Manufacturing Technology
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1109/tcpmt.2024.3492022
The original publisher provides the full text and its access options.
Cite this source
Yung-Seop Lee; Hyewon Ko; Min Soo Park; Yonghan Ju. Custom Design Experiments for Semiconductor Package Optimization. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2024-12. https://doi.org/10.1109/tcpmt.2024.3492022