Failure analysis of semiconductor bridge component in humid and hot environment
Rui Zhen Xie; Ming Li; Pei Fu; Jing Xin Zhang; Bing Bai; Ni Cheng; Hong Zhi Yao
- Published
- Publisher
- IOP Publishing
- Journal / collection
- Journal of Physics: Conference Series
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1088/1742-6596/2891/13/132016
The original publisher provides the full text and its access options.
Cite this source
Rui Zhen Xie; Ming Li; Pei Fu; Jing Xin Zhang; Bing Bai; Ni Cheng; Hong Zhi Yao. Failure analysis of semiconductor bridge component in humid and hot environment. Journal of Physics: Conference Series. 2024-12-01. https://doi.org/10.1088/1742-6596/2891/13/132016