Wire Bonding Failure Investigation in Semiconductor Packaging Process
Luana S. Rocha; Iara J. Fernandes; Celso Peter; Paulo R. Da S. Pereira
- Published
- Publisher
- IEEE
- Journal / collection
- 2024 IEEE URUCON
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1109/urucon63440.2024.10850051
The original publisher provides the full text and its access options.
Cite this source
Luana S. Rocha; Iara J. Fernandes; Celso Peter; Paulo R. Da S. Pereira. Wire Bonding Failure Investigation in Semiconductor Packaging Process. 2024 IEEE URUCON. 2024-11-18. https://doi.org/10.1109/urucon63440.2024.10850051