Fundamentals and Emerging Capabilities: 3D X-Ray Imaging for Semiconductor Advanced Package Failure Analysis
Cheryl Hartfield
- Published
- Publisher
- ASM International
- Journal / collection
- International Symposium for Testing and Failure Analysis
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.31399/asm.cp.istfa2024tpt1
The original publisher provides the full text and its access options.
Cite this source
Cheryl Hartfield. Fundamentals and Emerging Capabilities: 3D X-Ray Imaging for Semiconductor Advanced Package Failure Analysis. International Symposium for Testing and Failure Analysis. 2024-10-28. https://doi.org/10.31399/asm.cp.istfa2024tpt1