Recent Research and Packaging Application of Through Glass Via Technology for Artificial Intelligence Semiconductor
Chul Hwa Jung; Ji Won Park; Sung Jin Kim; Jae Pil Jung
- Published
- Publisher
- The Materials Research Society of Korea
- Journal / collection
- Korean Journal of Materials Research
- Research area
- AI & compute
- Source type
- Journal article
- DOI
- 10.3740/mrsk.2024.34.11.529
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Cite this source
Chul Hwa Jung; Ji Won Park; Sung Jin Kim; Jae Pil Jung. Recent Research and Packaging Application of Through Glass Via Technology for Artificial Intelligence Semiconductor. Korean Journal of Materials Research. 2024-11-27. https://doi.org/10.3740/mrsk.2024.34.11.529